Custom Fabless Supply - From specification to production parts     With an experience of more than 20 years in analog, logic and mixed-signal microelectronic design, DOLPHIN is the specialist of SoC Integration who will help you develop the physical implementation of your SoC, be it purely analog or purely logic or mixing analog and logic, whatever the complexity and the foundry.         SoC integration Refer to the SoC Integration page for detail   Fabless Supply Refer to Prototyping and Circuit fabrication and delivery for detail Download this Presentation sheet     Key offering Tailor-made feasibility study: technical and economics, Breadboarding and emulation, Specification for Integration, Selection of most appropriate subcontractors, Industrial Test Patterns generation, Prototype Characterization, Industrialization : streamlining of Fabrication, Packaging and Industrial Testing flows, Manufacturing Yield monitoring, Packaged chip reliability Control, Support in subsequent manufacturing phases     Overall Process Management Acting as the Enabler of Mixed Signal Systems-on-Chip, while mastering mixed signal Virtual Components of IP, takes its full significance when performing Custom Fabless Supply for "strategic quantities" when the Value Added is in the specifics of SoC development. DOLPHIN's know-how is unique for realizing upstream Virtual Test and delivering Mixed Signal SoCs right-on-first-pass is not a happenstance, it implies leaving no Design Checks to chance! When Value Added from Intellectual Property is the most important, the ultimate commitment involves streamlining the delivery of packaged SoCs and management of yield, reliability and inventories     Focus on Custom Fabless Supply Acting as the Enabler of Mixed Signal Systems-on-Chip, while providing mixed signal Virtual Components, takes its full significance when performing Custom Fabless Supply for "strategic quantities" when the Value Added is in the specifics of SoC development . Characteristics ViC Performances: High Resolution Small Area High Yield Power dissipation Voltage scaling High Reliability SoC Yield: ViC qualification Routing density ViC accessibility ERC, repair… Reliability: Part life Scheduling     Experience AKIRK (Airplane application): 4000 chips/year ARC429 (Airplane application): 6000 chips/year DSAIR (Airplane application for A380 – 8-channel ADC) : 6000 chips/year TYPHOON (FPGA to ASIC transfer): 1000 chips/year HURRICANE (FPGA to ASIC transfer): 1000 chips/year