Flash announcement
Availibility of low-power and high-density audio CODEC in TSMC 0.18 µm
The Enabler of Mixed Signal SoC announces the availability of its new generation of high-density audio CODEC in TSMC 0.18 µm process in addition to the other foundries already supported.
hiCODlv-9001 benefits from the latest design innovations for reliable operation with a single power supply at 1.8 V +/- 10 % both for analog and logic. This product thus stars low-power consumption, which significantly contributes to extending the operating time on battery of any multimedia portable device with audio.
While the audio quality of some CODECs suffer from PLL jitter on audio clocks, hiCODlv-9001 relies on a variable OSR architecture being patented, which enables to generate audio frequencies out of a single master clock - such as the popular 12 MHz of USB - at no expense of PLL.
Proposed with a range of single-ended input and output amplifiers and an thorough analog mixer, Fabless makers designing consumer electronics for MP3, DSC, PMP... can propose their customers a single-chip solution competitive in price and performances.
More than half a dozen of companies have already selected its new generation of low-voltage audio converters for processes ranging from 0.35 µm to 0.18 µm. Measurements made on chips embedding these audio ADC and DAC with low-voltage architecture have showed performances in line with original specifications thus demonstrating the efficiency of the proprietary “virtual fab” design process to minimize risks with first silicon.
The next generation of this high-performance audio CODEC will feature an even higher density for ensuring proper return on integration of SoCs in deep submicron processes such as 0.13 µm and 90 nm.
The quality of such audio converters with an evaluation board shall be demonstrated at the FSA expo this fall in San Jose on October 9, then in Taipei on November 1.
Feel free to contact us at jazz@dolphin.fr
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