Next generation of energy efficient SoCs

Come and meet us at TSMC Technology Symposium in Shanghai


TSMC 2018 Technology Symposium
Shanghai International Convention Center, Shanghai, China - May 22, 2018

Come on booth #15 to meet our team:

  • Frederic Renoux, EVP
  • Ying Zhao, Sales director for China
  • Hai Yu, Senior Field Application Engineer

Contact Ying Zhao

Ying Zhao
Sales director for China
Phone: +33 476 417 425

More Intelligent Design needed

The semiconductor industry is entering into the new era of More Intelligent Designs, whereby more complex SoC power architectures must be adopted to meet the low power challenges of battery-powered devices, as leveraging the fabrication process capabilities is no longer sufficient. Dolphin Integration's "Enabling Trio", combining new a breed of silicon IPs, EDA solution and Design Methodological Guides, paves the way for a cost-effective design of the next generation of ultra-low power SoCs.

To get insights on this innovative offering, visit our page:

Partnership for ultra Low-Power design

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